Hardware
Broadcom to supply HEVC SoC for Tata Sky Ultra HD STBs
MUMBAI: Broadcom Corporation has announced that it will be providing its BCM7252 high efficiency video codec (HEVC) H.265 system-on-chip (SoC) to Tata Sky. This will be utilised in the DTH operator’s Ultra HD set top boxes (STBs).
Tata Sky and Technicolor have teamed up to design and deploy its 4K STBs by 2015. Broadcom’s HEVC-enabled chipsets provide the compression and high-throughput required by operators and OEMs to rapidly introduce Ultra HD subscriber hardware and content. The Broadcom BCM7252 Ultra HD SoC improves coding efficiency and reduces video bandwidth usage by 50 per cent.
“We are committed to delivering an innovative and world class TV viewing experience. With the arrival of HEVC technology, our subscribers will soon be some of the first in the region to experience the live-action quality that only Ultra HD can provide,” said Tata Sky MD and CEO Harit Nagpal. “As Ultra HD TVs continue to become more affordable and Ultra HD content becomes more widely available, we anticipate increased subscriber demand for Ultra HD-capable set top boxes.”
“Technicolor is at the forefront of Ultra HD, working to enhance the Ultra HD experience on all screens by providing content preparation and 4K image certification for high quality STBs and video gateways. By leveraging Broadcom’s advanced Ultra HD devices with integrated HEVC compression technology, we can deliver 4K resolution at a frame rate of 60 frames-per-second while substantially reducing the bandwidth required for video transmission, and providing the advanced features and capabilities needed to enable the ultimate home viewing experience,” said Technicolor Connected Home Division senior vice president APAC Georges Laplanche.
“As consumer interest in Ultra HD continues to grow, Broadcom is delivering advanced devices with market-specific features and price points that allow consumers to enjoy an enhanced viewing experience regardless of their geography,” said Broadcom senior vice president marketing BCG Rich Nelson. “Broadcom continues to demonstrate its commitment to furthering the Ultra HD ecosystem across the globe, providing the innovation required by our customers to drive this technology quickly into the market, particularly as lower-cost Ultra HD TVs drive consumer awareness.”
Key Features of the BCM7252 Ultra HD SoC
• High-performance dual-core Brahma15 10000 DMIPs ARMv7 processors
• 2180p60 or dual 1080p60 decode and transcode capabilities
• Integrated connectivity peripherals including USB 3.0, PCIe, Gigabit Ethernet and MoCA 2.0
• Highest level of platform security, content protection and DRM robustness
• Dual display allowing presentation of two simultaneous video channels from the same STB via independent HDMI outputs and remote control devices
• Dedicated interfaces to a range of Broadcom companion front end cable, DOCSIS, satellite and 802.11ac Wi-Fi devices
Hardware
Specs Inc. partners with Qualcomm for next-generation smart glasses
Snap subsidiary to power future Specs with Snapdragon XR platforms.
MUMBAI: Snap’s Specs are about to get a serious upgrade and this time, they’re teaming up with Qualcomm to make sure the future looks crystal clear. Specs Inc., a Snap subsidiary, has announced a multi-year strategic agreement with Qualcomm Technologies to power future generations of its advanced smart eyewear with Snapdragon system-on-a-chip (SoC) technology.
This marks the first flagship engagement for Specs Inc., which is preparing to launch its standalone, see-through smart glasses for consumers later this year. The Specs are designed to seamlessly blend digital experiences into the physical world, allowing users to see, hear, and interact with digital content as if it were part of their real surroundings.
By integrating Snapdragon XR platforms, the glasses will benefit from edge AI and high-performance, low-power computing. This combination enables intelligent, context-aware experiences to run directly on the device, delivering faster and more private interactions.
The partnership builds on more than five years of collaboration between Snap and Qualcomm, during which Snapdragon platforms have powered multiple generations of Snap’s Spectacles.
Snap Inc., co-founder and CEO Evan Spiegel said, “We believe the future of computing will be more human and grounded in the real world. Our work with Qualcomm provides a strong foundation for the future of Specs, bringing advanced technology and performance that pushes the boundaries of what’s possible.”
Qualcomm Incorporated president and CEO Cristiano Amon added, “The next era of computing will be defined by devices that understand what you see, hear and say, and respond instantly to the world around you. Our collaboration on Specs will enable power-efficient interactive AR devices that feel natural and intuitive.”
The agreement establishes a scalable foundation for developers and partners building experiences for Specs, supporting a predictable product roadmap and increasingly sophisticated digital interactions over time.
In a world racing toward augmented reality, Specs Inc. and Qualcomm are ensuring that the next pair of smart glasses doesn’t just look good on paper, they perform brilliantly in real life. The future of wearable computing just got a powerful new lens.
