Apple signs $30 billion Broadcom deal to boost US chip production

MUMBAI: Apple is putting more chips on the table and this time they’re being made closer to home. The iPhone maker has signed a multiyear agreement worth more than $30 billion with Broadcom to manufacture advanced wireless technologies and custom silicon components in the United States, reinforcing its strategy to localise semiconductor production and build a more resilient supply chain.

The deal marks Apple’s largest commitment under its American Manufacturing Program (AMP) and is expected to result in the production of more than 15 billion US-made chips while supporting hundreds of manufacturing jobs.

As part of the agreement, Broadcom will invest $1.5 billion to expand and modernise its manufacturing facility in Fort Collins, Colorado. The site will produce advanced FBAR (Film Bulk Acoustic Resonator) filters and other radio frequency components that play a crucial role in wireless connectivity across Apple’s product portfolio.

The announcement also forms part of Apple’s broader commitment to invest $600 billion in the US economy over the next four years, spanning manufacturing, research and development, infrastructure and workforce development.

Apple chief executive Tim Cook said the partnership builds on the long-standing relationship between the two companies while accelerating the company’s commitment to American manufacturing and innovation. He noted that the components produced in Colorado are critical to delivering the connectivity and performance expected across Apple devices.

Broadcom president and chief executive Hock Tan said the company was proud to deepen its decades-long partnership with Apple while expanding its manufacturing footprint in Colorado.

Broadcom joined Apple’s American Manufacturing Program last year, an initiative aimed at strengthening domestic manufacturing capabilities and reducing dependence on overseas semiconductor production. The latest agreement significantly expands that partnership and further reinforces Apple’s US-based semiconductor ecosystem.

The chips covered under the agreement include advanced radio frequency components that enable wireless communication across Apple’s hardware. By increasing domestic production of these critical technologies, Apple aims to strengthen supply chain resilience while contributing to broader efforts to expand semiconductor manufacturing within the United States.

The move comes as global technology companies continue to ramp up investments in local chip production amid geopolitical tensions, supply chain disruptions and government-backed incentives encouraging domestic semiconductor manufacturing. For Apple, the latest investment signals that its manufacturing strategy is increasingly being shaped not only by innovation but also by geography, resilience and long-term supply chain security.