Brands
Lay’s partners with the Indian fashion label HUEMN
Mumbai: Lay’s has partnered with the Indian fashion label HUEMN to launch a limited-edition merchandise collection. This collaboration combines Lay’s vibrant colors with HUEMN’s distinctive fashion design, offering a bold new take on style.
Lay’s, known for its innovative products and flavors, is extending its playful spirit to fashion. HUEMN, recognised for its handcrafted pieces, merges artistry with bold expression. The collection provides a unique experience that reflects both brands’ commitment to cultural relevance.
The collaboration includes a special promotion where consumers might find HUEMN merchandise inside select Lay’s bags. Lay’s announced the partnership with a teaser and created an interactive treasure hunt in a department store’s Lay’s aisle. Selected loyal customers, identified through social listening, received golden tickets giving them the chance to find exclusive HUEMN merchandise hidden in Lay’s packs. This initiative combined the excitement of a treasure hunt with the appeal of high-end fashion, engaging Lay’s fans in a memorable way.
Expressing her delight on this association, PepsiCo India category lead – potato chips, Saumya Rathor said, “At Lay’s, we’re always looking for innovative ways to bring joy to our consumers, and our collaboration with HUEMN is a perfect example of that. By drawing inspiration from Lay’s vibrant colors, we’ve created a unique merchandise collection that speaks directly to our Lay’s fandom. For the launch, we’ve introduced an element of surprise, transforming the simple act of snacking into an exciting treasure hunt. Partnering with HUEMN, we are delivering an experience that goes beyond traditional snacking. We can’t wait for our fans to discover these limited-edition pieces and make them a part of their everyday style.”
Speaking on this HUEMN co-founder Pranav Misra said “As a brand, HUEMN has always championed wearable art that speaks to individualism and creativity. Inspired by the massive fandom surrounding Lay’s, this partnership is a celebration of the love and connection people have with their favourite potato chips. It’s about bringing the world of Lay’s and HUEMN together, offering the community a chance to wear something that represents both comfort and the joy of snacking. Creating this together with an iconic brand like Lay’s has been an incredible experience for all of us. We’re excited to see our communities embracing this unique association.”
“Lay’s is a brand that is part of culture and now with the HUEMN partnership we will be a part of pop-culture. This is a great example of how we believe partnerships can create magic,” said Publicis Groupe South Asia CCO and Leo Burnett South Asia chairman Rajdeepak Das.
The exclusive merchandise features classic sweatshirts, t-shirts and bodysuits adorned with playful Lay’s prints, offering a cool, visual appeal, that showcase Lay’s iconic branding. Each piece is crafted with high-quality materials, making them fun, comfortable, and perfect for the colder months approaching. The merchandise will be sold at HUEMN stores and HUEMN.in, starting today.
Brands
Tessolve lands a semiconductor veteran to drive its next big push
Ravi Kumar Chirugudu, who started his career at ISRO and has spent 35 years building chips and companies, joins the Bengaluru-based firm as president and chief operating officer
BENGALURU: Tessolve has never been shy about its ambitions. The Bengaluru-based engineering services firm already counts 18 of the world’s top 20 semiconductor companies among its clients, employs more than 3,500 engineers across 12 countries, and last year pocketed a $150m investment from TPG. Now it has hired the executive it believes can turn those assets into something bigger. Ravi Kumar Chirugudu, a 35-year semiconductor veteran who once built satellite payloads for ISRO and has since scaled engineering organisations across three continents, joins as president and chief operating officer, effective immediately.
THE MAN AND THE MANDATE
The appointment is, by any measure, a serious hire. Ravi Kumar Chirugudu comes to Tessolve after senior leadership stints at HCL Technologies, Altran and Wipro, where he managed large profit-and-loss portfolios and oversaw cross-regional teams. Over the course of his career, he has been instrumental in bringing more than 1,000 new products to market across the high-tech, energy and manufacturing verticals. Before the private sector claimed him, he began his working life as a scientist at the Indian Space Research Organisation, contributing to research and development in charge-coupled device technology and satellite payloads, a foundation that shaped everything that followed.
In his new role, he will lead Tessolve’s global growth strategy: expanding its engineering capabilities, deepening customer relationships and accelerating innovation across semiconductor and high-performance computing domains. The brief is broad, but the context is specific. Tessolve operates in the $550 billion global semiconductor market, and its recent moves, the acquisition of Germany’s Dream Chip Technologies and the TPG funding round, have sharpened both its reach and its expectations.
Srini Chinamilli, co-founder and chief executive of Tessolve, is characteristically direct about why Ravi Kumar Chirugudu was the choice:
“As we scale our global semiconductor and system engineering capabilities, Ravi’s appointment marks an important step forward. As global semiconductor demand continues to accelerate across industries, it is creating significant opportunities across the semiconductor lifecycle, from design, packaging, validation and systems integration. Ravi’s deep knowledge and leadership in this ecosystem brings the right mix of industry expertise, customer connect and execution capability, which will play a key role in strengthening our position as a trusted global engineering partner and reinforcing our market leadership.”
THE NEW ARRIVAL SPEAKS
Ravi Kumar Chirugudu, for his part, frames the move in terms of timing and culture, two factors that veteran executives tend to weigh as heavily as title or compensation:
“I am happy to join Tessolve at a time when the industry is rapidly evolving towards more complex, AI-driven systems. What stands out to me is its strong people-first culture and its commitment to bringing value to its customers. The strength of its global team, combined with its deep expertise in semiconductor innovation and next-generation product engineering, creates a solid foundation to build differentiated, scalable solutions. I look forward to working closely with the team to drive strategic growth and strengthen its role in shaping the global semiconductor ecosystem.”
The reference to AI-driven systems is not incidental. The semiconductor industry is in the midst of a structural reshaping, driven by the insatiable compute demands of artificial intelligence. For engineering services firms like Tessolve, which offers end-to-end capabilities from silicon design to packaged parts and invests in high-performance computing, high-speed interfaces, photonics and 5G, the moment is both an opportunity and a test. The company says it is well positioned to capture the next wave of industry growth. Ravi Kumar Chirugudu is now the person who has to prove it.
He came in from outer space, literally, and spent three decades learning how the semiconductor industry works from the inside out. Now Tessolve is betting that accumulated knowledge can help it cross the next frontier. In the $550 billion global chip market, the gap between ambition and execution is measured in engineering hours and leadership quality. Tessolve has just gone shopping for both.
